Microelectronic Processing
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Microelectronic Processing Technician Course Curriculum
Author: International Society for Hybrid Microelectronics
language: en
Publisher:
Release Date: 1987
Electrochemical Processing in ULSI and MEMS 3
Author: John O. Dukovic
language: en
Publisher: The Electrochemical Society
Release Date: 2007-09
The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
